PROGRAM SCHEDULE
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Monday, October 27
Mon, Oct 27 | Tue, Oct 28 | Interactive | Wed, Oct 29
| 9:30 |
Tutorial Session ESH
"SUSTAINABILITY AND ESH ASPECTS OF ADVANCED SEMICONDUCTOR MANUFACTURING" |
|
Tutorial Session AEC/APC
"Introduction of AECAPC's history"
"Manufacturing engineering and AEC/APC"
"Application of control theory for AEC/APC in semiconductor fabrication" |
ISSM 2008
| 13:00 | Opening Remarks |
| 13:20 | Keynote Speech: Challenges in The DRAM Business Mr.Yukio Sakamoto, President&CEO, Elpida Memory,Inc. |
| 14:10 | Keynote Speech: The New Dynamics of Semiconductor Industry Dr. Tien Wu Chief Operating Officer, Board of Directors, Advanced Semiconductor Engineering Inc.(ASE) |
| 15:00 | Break |
Room A
| Advanced Lithography Session | |
| 15:10 | PE-O-97: Phenomenology of ArF Photoresist Shrinkage Trends Benjamin Bunday, ISMI |
| 15:30 | PE-O-44: Lithography Hotspot Discovery at 70nm DRAM 300mm Fab : Process Window Qualification Using Design Based Binning Masami Aoki, KLA-Tencor |
| 15:50 | YE-O-109: From Simulation to Characterization - Integrated Approach for Self Aligned Double Patterning Defectitivity Amiad Conley, Applied Materials |
| 16:10 | Author's interview & Break |
| 16:30 | PO-O-40: Defect Reduction in ArF Immersion Lithography, Using Particle Trap Wafers with CVD Thin Films Yoshinori Matsui, NEC Electronics |
| 16:50 | PO-O-154: Defectivity Readiness for Immersion Scanner Qualification Towards 32nm production wafers Naoaki Yamaguchi , Applied Materials |
| 17:10 | UC-O-110: Defect Reducton in Advanced Lithography Processes Using a New Dual Functionality Filter Aiwen Wu, Entegris |
| 17:30 | Author's interview & Break |
| 18:30 | Reception |
Room B
| Manufacturing Strategy and Management (MS) | |
| 15:10 | MS-O-120: Advanced quality control of quartz parts for semiconductor equipment based on the food industry's well-established QC methodology(HACCP) Kazuya Dobashi, Tokyo Electron |
| 15:30 | MS-O-59: Highly Accurate Management in the Dynamically Improving Fab Capacity kazunori Imaoka, Spansion |
| 15:50 | MS-O-66: Accelerating R&D Learning: Cycle Time Reduction of A Technology Development Fab Mike Zhang, Spansion |
| 16:10 | Author's interview & Break |
| 16:30 | MS-O-196: Exploratory Study on Emerging Integrator Business Model in Engineering Chain of the Semiconductor Industry: Re-integration of Vertical Disintegration Yea-Huey Su, National Central University |
| 16:50 | MS-O-199: System Perspective on the Business Model Structures of TSMC and UMC: Foundations of Business Model Design for a Company Yea-Huey Su, National Central University |
| 17:10 | MS-O-202: Method and System for Determining Optimal Wafer Sampling in Realtime Inline Monitoring and Experimental Design Kari Johnson, Micron Technology |
| 17:30 | Author's interview & Break |
| 18:30 | Reception |
Tuesday, October 28
Mon, Oct 27 | Tue, Oct 28 | Interactive | Wed, Oct 29
| 9:00 | Keynote Speech: Manufacturing Challenges in Automotive Nanoelectronics Dr. Reinhard Ploss, Member of the Management Board Operations, Infineon Technologies AG |
| 9:50 | Keynote Speech: Heterogeneous Integration and Clustered Virtual Vertical Integration for IC Industry Dr. Nicky C. C. Lu, Chairman/CEO, Etron Technology, Inc. |
Room A
| Process and Metrology Equipment (PE) | |
| 11:00 | PE-O-161: Study of Ion implantation induced gate oxide quality problem and its solutions. Kazuhisa Shiraki, OMRON |
| 11:20 | PE-O-125: Novel Single-Wafer, Single-Chamber Dry/Wet-Combination System for Stripping and In-situ Cleaning of High-Dose Ion-Implanted Photoresists Yi-jung Kim, SEMES CO.,LTD |
| 11:40 | PE-O-34: Prediction of Film Thickness of Bottom Anti-Reflective Coating Based on In-Line Viscosity Measurement Masato Ota, Levitronix LLC |
| 12:00 | Author's interview & Lunch Time |
| 13:20 | Keynote Speech: From Radical Innovation to Radical Collaboration - The Industry in Flux Dr. Bernard S. Meyerson, VP Strategic Alliances and CTO, IBM Fellow, IBM Systems and Technology Group, IBM Corp. |
| 14:10 | Break |
| Advanced Metrogy Session | |
| 14:20 | PE-O-143: Optical Ellipsometry for SiON Gate Production Monitoring Sungchul Yoo, KLA-Tencor |
| 14:40 | PE-O-16: Measuring SADP Features of 22nm Technology Node with Old Generation CD SEMs James Jiahua Yu, Applied Materials |
| 15:00 | PE-O-136: In-Line Metrology for the 45 nm and 32 nm Nodes John Allgair, ISMI |
| 15:20 | YE-O-9: Detection of Non Visible Poly Leakage Defect by e-Beam Inspection Shinya Ito, Spansion |
| 15:40 | YE-O-200: Challenge Systemic Defects Control in advance DRAM Fab Luke Lin, Powerchip Semiconductor |
| 16:00 | YE-O-135: Investigation and solution of bump-like killer defects Hong Xiao, Hermes Microvision |
| 16:20 | Author's interview & Break |
Room B
| Factory Design (FD) | |
| 11:00 | FD-O-129: Timed Move Command for improved on-time AMHS delivery Joerg Luebke, AMD |
| 11:20 | FD-O-45: Impacts of Small lot Manufacturing on AMHS Hiroshi Kondo, Asyst Technologies Japan |
| 11:40 | Author's interview & Lunch Time |
| 13:20 | Keynote Speech: From Radical Innovation to Radical Collaboration - The Industry in Flux Dr. Bernard S. Meyerson, VP Strategic Alliances and CTO, IBM Fellow, IBM Systems and Technology Group, IBM Corp. |
| 14:10 | Break |
| Manufacturing Control and Execution (MC) | |
| 14:20 | MC-O-12: Fully automation control system for golden super hot lot in 300mm Fab TE Lung Wu, Rexchip Semiconductor |
| 14:40 | MC-O-103: Multiple Lot in One FOUP(MLiF) Control and Management System in the 300mm Fab Nian-Wei Chan, Rexchip Semiconductor |
| 15:00 | MC-O-19: Throughput improvement with setup reduction focusing on process identification Yoshiaki Kobayashi, Renesas Technology Corp. |
| 15:20 | MC-O-27: Win-Win Approach Between Tool Productivity and Delivery Fulfillment By Carpool Execution Yih-Yi Lee, TSMC |
| 15:40 | MC-O-47: In-line inspection impact on Cycle Time and Yield Israel Tirkel, Ben-Gurion University |
| 16:00 | Author's interview & Break |
3-min Summary Presentation for Interactive Poster Session
Mon, Oct 27 | Tue, Oct 28 | Interactive | Wed, Oct 29
Room A
| 16:40 | MS-P-18: Using DEA for Relative Efficiency Analysis of Wafer Fabrication Facilities Wan Ling Lin, TSMC |
| 16:44 | MS-P-57: Knowledge Sharing and Creation in the Semiconductor Equipment Industry Tsuyoshi Moriya, Tokyo Electron |
| 16:48 | MS-P-122: Improving Customer Responsiveness at Assembly Test Operations with the Application of Manufacturing Science Joan Tafoya, Intel |
| 16:52 | MS-P-180: Overall Equipment Efficiency (OEE) Improvements for Lithographic Tools in Wafer Fab Surein Gopal , Sii Terra |
| 16:56 | FD-P-123: Think Outside of the Integrated Circuit Fabricator Box Bevan Wu, BW & Associates |
| 17:00 | MC-P-5: TAT Cost Calculation of a Wafer in a Lot Hiroyuki Okumura, NEC Electronics |
| 17:04 | MC-P-15: Manual Material Handling System for 8-inch Fab Wen-Cheng Chen, TSMC |
| 17:08 | MC-P-32: A Scanner Throughput Monitoring System (STMS) for Continuously Improving Litho-Cluster Productivity Wei Tai Chen, UMC |
| 17:12 | MC-P-115: Optimal Load Allocation Method for Keeping Target TAT Akira Ono, Renesas Technology |
| 17:16 | MC-P-128: A Study of Multiple Objectives Real-Time Dispatcher for Wafer Fabrication Asok Kumar , Sii Terra |
| 17:20 | ES-P-35: A Safer Alternative to Hydrofluoric Acid for Cleaning Epitaxial Silicon Reactor Exhaust Parts Tamir F. Ayad, P.E., ST Microelectronics |
| 17:24 | PE-P-17: Influence of deteriorated i-line filter on image quality of exposure tools, and its improvement KAZUNORI OKUYAMA, Fujitsu |
| 17:28 | PE-P-67: Study on Gas Replacement Time in Plasma Process Chamber for Realizing Ideal Down Flow of Gas without Disturbance Sadaharu Morishita, OMRON |
| 17:32 | PE-P-127: Monitor and management system of equipment operation status Masatoshi Ikeda, Selete |
| 17:36 | PE-P-173: LOG data analysis and application for exposure tool Yukio Ibe, SANYO Electronics |
| 17:40 | DM-P-119: Robust Design with Direct Product of the L18 Orthogonal Arrays Nobuichi Kuramochi, Toshiba |
| 17:44 | FM-P-2: Invisible Ejector Characteristics Chandrasagaran, Moganasundaram, Intel |
Room B
| 16:40 | PO-P-113: Design Optimization of Lateral DMOS Using Genetic Algorithm Hideto Mitsuhashi, New Japan Radio Co., Ltd |
| 16:44 | PO-P-162: The new era started by the MEMS large scale production with 200mm wafers Nobuyuki Iida, OMRON |
| 16:48 | PO-P-174: BPSG boron spike generation investigated by chamber pressure monitoring Toshiya Yokota, Spansion |
| 16:52 | PO-P-195: Manufacturability Considerations in Double Patterning Lithography Junji Miyazaki, ASML |
| 16:56 | PC-P-10: An Algorithm to Visualize Tool Difference Transitions in Semiconductor Fabrications Tomoaki Kubo, Toshiba |
| 17:00 | PC-P-33: Characterization Algorithm of Equipment-caused Particle Trend for LSI Yield Improvement Masaaki Sugimoto, NEC Electronics |
| 17:04 | PC-P-96: A Cost-Effective Alternative to Moisture Monitoring in Epitaxial Silicon Processing Tamir Ayad, ST Microelectronics |
| 17:08 | PC-P-108: APC - The Consequent Next Step Dr. Michael Brueggemann, Infineon |
| 17:12 | PC-P-116: Photolithography Run-to-Run Metrology Control Using Multiple Algorithms for Mass Production Enhancement yung-yao lee, ProMos Technologies |
| 17:16 | PC-P-150: FDC-methods as trigger for preventive maintenance for hot- and wet-process equipment Michael Brueggemann, Infineon |
| 17:20 | UC-P-157: Direct Monitoring of Semiconductor Wafer Cleaning Solutions Using Attenuated Total Reflection Far Ultraviolet Spectroscopy Noboru Higashi, KURABO |
| 17:24 | YE-P-20: A trend mining method for yield improvement based on trend in time series Hidetaka Tsuda, Fujitsu LSI Technology Limited |
| 17:28 | YE-P-105: In-line material analysis of 50nm defects by integration of Energy (EDX) and Wavelength (WDX) Dispersive X-ray analysis Tomoyuki Tada, Applied Materials |
| 17:32 | YE-P-160: Yield enhancement through new solutions for queue time containment VERAN, AVTF |
| 17:36 | YE-P-165: Optical Beam Enhanced Defect Detection With Electron Beam Inspection Tools Yan Zhao, Hermes Microvision |
| 17:40 | YE-P-185: Knowledge Engineering of Analysis Tool Application Processes for Yield Symptom Identification Shi-Chung Chang, National Taiwan University |
Wednesday, October 29
Mon, Oct 27 | Tue, Oct 28 | Interactive | Wed, Oct 29
| 9:00 | ISSM 2009 Announcement |
| 9:10 | Invited Speech: AEC/APC Thomas Sonderman, Vice President of Manufacturing Systems Technology (MST), AMD |
Room A
| AEC/APC Session | |
| 10:00 | PC-O-106: Interconnection failure caused by bath degradation in copper electro-plating Shin-ichi Imai, Matsushita Electric (Panasonic) |
| 10:20 | PC-O-49: Virtual Metrology Modeling for Plasma Etch Operations DeKong Zeng, University of California Berkeley |
| 10:40 | PC-O-130: Comprehensive plug and play FD system realized Predictive Maintenance Katsuhisa Sakai, Renesas Technology |
| 11:00 | PC-O-42: Centering value by using TSMRA prediction of CD process variation Shigenobu. Murashima, NEC Semiconductors Kansai, Ltd |
| 11:20 | Author's interview & Break |
| Process Control and Monitoring (PC) | |
| 11:40 | PC-O-3: Focus and CD Control by Scatterometry Measurements for 65/45nm node devices TOSIHIIHIDE KAWACHI, Renesas Technology |
| 12:00 | PC-O-4: Advanced endpoint detection tool of NF3 remote plasma cleaning Kazuyuki Fujii, Renesas Technology |
| 12:20 | Author's interview & Lunch Time |
| 13:20 | PC-O-187: BEOL parametric variation control with FDC data Hideki Matsuhashi, PDF Solutions, Inc |
| 13:40 | PC-O-41: Approach of Continuous Device Reliability Improvement Activity in Manufacturing Stage Akira Inoue, NEC Electronics |
| 14:00 | Author's interview & Break |
| Final Manufacturing (FM) | |
| 14:20 | FM-O-53: TLS-Dicing – the way to higher yield and throughput Hans-Ulrich Zuehlke, Jenoptik Automatisierungstechnik GmbH |
| 14:40 | FM-O-175: Effect of type of foil and blade type to backside chipping in wafer level packages Peh Kok Hua, Infineon |
| 15:00 | FM-O-82: 300mm Wafer Stain Formation by Spin Etching Keisuke Sato, SEZ |
| 15:20 | Author's interview & Break |
| Process and Material Optimization (PO) | |
| 15:40 | PO-O-172: Enhancing Electrical Properties of Nickel Silicide by Using Spike Anneal as the Second RTA Takuya Futase, Renesas Technology Corp. |
| 16:00 | PO-O-64: Productivity Improvement for a Zr-base High-k Film Deposition using Thermal Chamber Cleaning Technique Hirohisa yamazaki, Hitachi Kokusai Electric Inc. |
| 16:20 | PO-O-25: Achieving high gate oxide quality by wet process improvement Masakazu Yasu, OMRON |
| 16:40 | PO-O-141: Application of quality engineering for Cu damascene etching Yusuke Oda, NEC Electronics |
| 17:00 | PO-O-8: High Reliable Characteristics in Manufacturing of MEMS Pressure Sensor Tetsuhiro Zushi, OMRON |
| 17:20 | Author's interview |
Room B
| Design for Manufacturing (DM) | |
| 10:00 | DM-O-93: Electrically Testable CMP Characterization Vehicle for DFM, Process Transfer, and Process Development Jule Segal, Spansion |
| 10:20 | DM-O-145: Eliminating Stress-Induced Junction Leakages at Minimum Polysilicon-Active Space in Advanced Embedded High Voltage CMOS Technologies Moey Chin Boon, Systems on Silicon Manufacturing |
| 10:40 | DM-O-118: Optimal Process Design for on-chip Micro-lenses with Quality Engineering Yasuhisa Oomuro, Toshiba |
| 11:00 | Author's interview & Break |
| Environment, Safety and Health (ES) | |
| 11:20 | ES-O-132: Technology-Enabled Employee Wellness: Emerging Trends, Applications, and Results Scott Lantz, Intel |
| 11:40 | ES-O-131: Overall Green Efficiency Enhancement with Manufacturing process optimization in KMO Tan Lin Sheng , Intel |
| 12:00 | ES-O-182: Going Green with On-Site Generated Fluorine: Sustainable Cleaning Agent for CVD Processes Paul Stockman, Linde Electronics |
| 12:20 | Author's interview & Lunch Time |
| Ultraclean Technology (UC) | |
| 13:20 | UC-O-56: A Novel Filter Rating Method for less than 30 nm particle Takehito Mizuno, Nihon Pall Ltd. |
| 13:40 | UC-O-117: Minute-particle reduction by applying thermophoresis to semiconductor production equipment Hidefumi Matsui, Tokyo Electron |
| 14:00 | Author's interview & Break |
| Yield Enhancement Methodology (YE) | |
| 14:20 | YE-O-36: Reducing contamination of particles reflected in turbo molecular pump Hiroyuki Kobayashi, Hitachi |
| 14:40 | YE-O-85: Qualification of inline FIB for Production: A Comprehensive Contamination Study Tomoyuki Tada, Applied Materials |
| 15:00 | YE-O-114: Integrated defect sampling method by using design attribute for high sensitivity inspection in 45nm production environment yasuhiro kaga, Toshiba |
| 15:20 | YE-O-43: EES Data Analysis of Lithography Trouble Detected by MapSSA Hiroshi Matsushita, Toshiba |
| 15:40 | Author's interview & Break |
| 16:00 | YE-O-84: Proposal of Backside Die-level Analysis Takeshi Yoshida, Renesas Technology |
| 16:20 | YE-O-54: High Voltage Gate Oxide Integrity for Embedded Flash Memory Devices Moey Chin Boon, Systems on Silicon Manufacturing |
| 16:40 | YE-O-170: Analysis of Deep Scratch Daisuke Takeda, Spansion |
| 17:00 | YE-O-58: Yield Monitoring System for Silicon Wafer Mayumi Kogure, Spansion |
| 17:20 | Author's interview |