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COMMITTEE

Chairman:: Satoru Ito, Renesas Technology Corp.
Vice Chairman:: Tadahiro Ohmi, Tohoku University
Chairman Emeritus:: Hajime Sasaki, NEC Corp.
Committee:: Keiji Horioka, Applied Materials Japan Inc.; Nobuo Kawase, Canon Corp.; Haruyoshi Yagi, Fujitsu Microelectronics Ltd.; Hideo Kawasaki, Panasonic Corp.; Michihiro Inoue, Panasonic Corp.; Masataka Hirose, National Institute of Advanced Industrial Science and Technology; Tatsuo Yoshino, NEC Electronics Corp.; Akikazu Tanimoto, Nikon Corp.; Hironori Kitabayashi, Oki SEMICONDUCTOR Co., Ltd.; Yoshitake Ito, OMRON Corp.; Hidemi Takasu, Rohm Co., Ltd.; Tadashi Nishimura, Renesas Technology Corp.; Teruo Tabata, Sanyo Electric Co., Ltd.; Hiroshi Nishioka, Sharp Corp.; Haruo Iwatsu, Tokyo Electron Ltd.; Shunichi Hiraki, Toshiba Corp.

Committee:: Masahiro Kashiwagi, Keio University; Yasuo Mizokami, KLA-Tencor Japan Ltd.; Yoichi Akasaka, Osaka University; Shigeru Nakayama, SEMI; Kimio Yanagida, Tokyo Electron Ltd.; Yasusuke Sumitomo, Toshiba Corp.

Chairman:: Michihiro Inoue, Panasonic Corp.
Vice Chairman:: Takeshi Hattori, Semiconductor International Japan Edition; Makoto Hirayama, State University of New York, College of Nanoscale Science and Engineering
Committee:: Horioka Keiji, Applied Materials Japan Inc.; Hiroji Iwahori, Canon Corp.; Kensuke Uriga, Dura Systems Ltd.; Toshihiko Osada, Fujitsu Microelectronics Ltd.; Hiroyuki Chuma,Institute of Innovation Research, Hitotsubashi University; Naoki Kitano, Intel K.K.; Shuuichi Inoue, NEC Electronics Corp.; Masaomi Kameyama, Nikon Corp.; Koji Kitamura, OMRON Corp.; Koji Maekawa, PDF Solutions; Toshio Suganuma, SANYO Electric Co., Ltd.; Kazuma Minami, Seiko Epson Corp.; Yoichi Nakagawa, SEMI Japan; Masayasu Tsunematsu, Semiconductor Equipment Association of Japan; Osamu Minato, Semiconductor Leading Edge Technologies, Inc.; Kazuhiro Moritani, Sharp Corp.; Jun Ueda, SIRIJ; Takashi Yoda, Toshiba Corp.; Yoriyuki Murakawa, Realize AT Ltd.; Hajime Iijima, Renesas Technology Corp.; Akira Kamisawa, Rohm Co., Ltd.

Chairman:: Nobuhiro Otsuka, Hitachi, Ltd.
Executive Vice Chairman:: Toshiyuki Uchino,
Renesas Technology Corp.
Vice Chairman:: Hidetoshi Koike, Toshiba Corp. Semiconductor Company; Kiyotaka Imai, KLA-Tencor Japan Ltd.
Committee:: Kazunori Kato, Advanced Interface Technology Corp.; Shinsuke Mizuno, Applied Materials Japan, Inc.; Eisuke Nishitani, Hitachi Kokusai Electric Inc.; Kenji Watanabe, Hitachi High-Technologies Corp.; Toshihiko Osada, Fujitsu Microelectronics Ltd.; Shin-ichi Imai, Panasonic Corp.; Shinichi Domae, Panasonic Corp.; Takeshi Akimoto, NEC Electronics Corp.; Michio Honma, NEC Electronics Corp.; Harufumi Kobayashi, Oki SEMICONDUCTOR Co., Ltd.; Fumitaka Homma, Oki SEMICONDUCTOR Co., Ltd.; Katsutoshi Ozawa, OMRON Corp.; Yoshio Iwata, Renesas Technology Corp.; Toshiharu Katayama, Renesas Technology Corp.; Yoshiaki Oku, Rohm Co., Ltd.; Masahide Maeda, Rohm Co., Ltd.; Hiroshi Ishizeki, SANYO Semiconductor Co., Ltd.; Tetsuya Miwa, SANYO Semiconductor Co., Ltd.; Isamu Namose, Seiko Epson Corp.; Masahiko Minamide, Sharp Corp.; Atsushi Someya, Sony Corp.; Shouji Tsuruda, Sony Semiconductor Kyushu Corp.; Fumihiko Inoue, Spansion Japan Ltd.; Kenji Miyake, Texas Instruments Japan Ltd. Hiji Plant; Kazuyuki Saito, The University of Aizu; Takanobu Kaitsuka, Tokyo Electron, Ltd.; Ayako Shimazaki, Toshiba Corp. Semiconductor Company; Hiromi Yajima, Toshiba Corp. Semiconductor Company; Kelly Andrew, ULVAC, Inc.

Chairman:: Jim Doran, Spansion
Committee:: Thomas Sonderman, AMD; Patrick Lamey, Applied Materials; Mihir Parikh Ph. D., Aquest Systems Corp.; Steve Schwartz, Asyst; Bill Dunnigan, Cypress Semiconductor Company; Rick McFarland, Freescale; Alain C Diebold, IEEE EDS; Peter Kuecher, Infineon; Gerald Elder, Intel; Patricia A. McDonald, Intel; Phillip Moyhagh, Intel; Rick Wallace, KLA-Tencor; Jeff Mendiola, Micron Technology; Paul Edmonds, National Semiconductor; Kim Wisneski, National Semiconductor; Shi-Chung Chang, National Taiwan University; John Chenault, Novellus System; Ajit Manocha, Philips Semiconductor; Young-bum Koh, Samsung; Mike Polcari, SEMATECH; Victoria Hadfield, SEMI; Stanley T. Myers, SEMI; Laurent Bosson, ST Microelectronics; Yoshio Nishi, Stanford University; John Lin, TSMC; Mark Liu, TSMC; Jenn Tsao, UMC; Chia Pin Lee, United Microelectronics Corp.; Dave Hodges, University of California at Berkeley

Chairman:: Thomas Sonderman, AMD
Committee:: Bill Brennan, AMD/Spansion; Bill Arnold, ASML; Rajendra Singh, Clemson University; Jeff McNeil, Cypress; Lothar Pfitzner, Fraunhofer - IIS-B; Linda Milor, Georgia Tech; Marc Meuris, IMEC; Joerg Domaschke, Infineon; Gerald Elder, Intel; Philip Moynagh, Intel; Steve Swan, National Semiconductor; Shi-Chung Chang, National Taiwan University; Keith Hansen, Novellus; Tae-Sung Kim, Samsung; Chuck Stager,SEMATECH; Scott S. Kramer, SEMATECH; Fumitake Mieno, SMIC; Christian Carlier, ST Microelectronics; John Lin, TSMC; Jenn Tsao, UMC; Chia Pin Lee, United Microelectronics Corp.; Costas Spanos, University of California at Berkeley; Risto Puhakka, VLSI Research; ASHRAF EL SAYED MOHAMED