COMMITTEE
Japan Organizing Committee
- Chairman:
- Satoru Ito, Renesas Technology Corp.
- Vice Chairman:
- Tadahiro Ohmi, Tohoku University
- Chairman Emeritus:
- Hajime Sasaki, NEC Corp.
- Committee:
- Keiji Horioka, Applied Materials Japan Inc.
- Nobuo Kawase, Canon Corp.
- Haruyoshi Yagi, Fujitsu Microelectronics Ltd.
- Hideo Kawasaki, Panasonic Corp.
- Michihiro Inoue, Panasonic Corp.
- Masataka Hirose, National Institute of Advanced Industrial Science and Technology
- Tatsuo Yoshino, NEC Electronics Corp.
- Akikazu Tanimoto, Nikon Corp.
- Hironori Kitabayashi, Oki SEMICONDUCTOR Co., Ltd.
- Yoshitake Ito, OMRON Corp.
- Hidemi Takasu, Rohm Co., Ltd.
- Tadashi Nishimura, Renesas Technology Corp.
- Teruo Tabata, Sanyo Electric Co., Ltd.
- Hiroshi Nishioka, Sharp Corp.
- Haruo Iwatsu, Tokyo Electron Ltd.
- Shunichi Hiraki, Toshiba Corp.
Japan Advisory Board
- Members:
- Tsuyoshi Kawanishi, TEK Consulting
Japan Advisory Committee
- Committee:
- Masahiro Kashiwagi, Keio University
- Yasuo Mizokami, KLA-Tencor Japan Ltd.
- Yoichi Akasaka, Osaka University
- Shigeru Nakayama, SEMI
- Kimio Yanagida, Tokyo Electron Ltd.
- Yasusuke Sumitomo, Toshiba Corp.
Japan Executive Committee
- Chairman:
- Michihiro Inoue, Panasonic Corp.
- Vice Chairman:
- Takeshi Hattori, Semiconductor International Japan Edition
- Makoto Hirayama, State University of New York, College of Nanoscale Science and Engineering
- Committee:
- Horioka Keiji, Applied Materials Japan Inc.
- Hiroji Iwahori, Canon Corp.
- Kensuke Uriga, Dura Systems Ltd.
- Toshihiko Osada, Fujitsu Microelectronics Ltd.
- Hiroyuki Chuma,Institute of Innovation Research, Hitotsubashi University
- Naoki Kitano, Intel K.K.
- Shuuichi Inoue, NEC Electronics Corp.
- Masaomi Kameyama, Nikon Corp.
- Koji Kitamura, OMRON Corp.
- Koji Maekawa, PDF Solutions
- Toshio Suganuma, SANYO Electric Co., Ltd.
- Kazuma Minami, Seiko Epson Corp.
- Yoichi Nakagawa, SEMI Japan
- Masayasu Tsunematsu, Semiconductor Equipment Association of Japan
- Osamu Minato, Semiconductor Leading Edge Technologies, Inc.
- Kazuhiro Moritani, Sharp Corp.
- Jun Ueda, SIRIJ
- Takashi Yoda, Toshiba Corp.
- Yoriyuki Murakawa, Realize AT Ltd.
- Hajime Iijima, Renesas Technology Corp.
- Akira Kamisawa, Rohm Co., Ltd.
Japan Program Committee
- Chairman:
- Nobuhiro Otsuka, Hitachi, Ltd.
- Executive Vice
Chairman: - Toshiyuki Uchino,
Renesas Technology Corp. - Vice Chairman:
- Hidetoshi Koike, Toshiba Corp. Semiconductor Company
- Kiyotaka Imai, KLA-Tencor Japan Ltd.
- Committee:
- Kazunori Kato, Advanced Interface Technology Corp.
- Shinsuke Mizuno, Applied Materials Japan, Inc.
- Eisuke Nishitani, Hitachi Kokusai Electric Inc.
- Kenji Watanabe, Hitachi High-Technologies Corp.
- Toshihiko Osada, Fujitsu Microelectronics Ltd.
- Shin-ichi Imai, Panasonic Corp.
- Shinichi Domae, Panasonic Corp.
- Takeshi Akimoto, NEC Electronics Corp.
- Michio Honma, NEC Electronics Corp.
- Harufumi Kobayashi, Oki SEMICONDUCTOR Co., Ltd.
- Fumitaka Homma, Oki SEMICONDUCTOR Co., Ltd.
- Katsutoshi Ozawa, OMRON Corp.
- Yoshio Iwata, Renesas Technology Corp.
- Toshiharu Katayama, Renesas Technology Corp.
- Yoshiaki Oku, Rohm Co., Ltd.
- Masahide Maeda, Rohm Co., Ltd.
- Hiroshi Ishizeki, SANYO Semiconductor Co., Ltd.
- Tetsuya Miwa, SANYO Semiconductor Co., Ltd.
- Isamu Namose, Seiko Epson Corp.
- Masahiko Minamide, Sharp Corp.
- Atsushi Someya, Sony Corp.
- Shouji Tsuruda, Sony Semiconductor Kyushu Corp.
- Fumihiko Inoue, Spansion Japan Ltd.
- Kenji Miyake, Texas Instruments Japan Ltd. Hiji Plant
- Kazuyuki Saito, The University of Aizu
- Takanobu Kaitsuka, Tokyo Electron, Ltd.
- Ayako Shimazaki, Toshiba Corp. Semiconductor Company
- Hiromi Yajima, Toshiba Corp. Semiconductor Company
- Kelly Andrew, ULVAC, Inc.
International Executive Committee
- Chairman:
- Jim Doran, Spansion
- Committee:
- Thomas Sonderman, AMD
- Patrick Lamey, Applied Materials
- Mihir Parikh Ph. D., Aquest Systems Corp.
- Steve Schwartz, Asyst
- Bill Dunnigan, Cypress Semiconductor Company
- Rick McFarland, Freescale
- Alain C Diebold, IEEE EDS
- Peter Kuecher, Infineon
- Gerald Elder, Intel
- Patricia A. McDonald, Intel
- Phillip Moyhagh, Intel
- Rick Wallace, KLA-Tencor
- Jeff Mendiola, Micron Technology
- Paul Edmonds, National Semiconductor
- Kim Wisneski, National Semiconductor
- Shi-Chung Chang, National Taiwan University
- John Chenault, Novellus System
- Ajit Manocha, Philips Semiconductor
- Young-bum Koh, Samsung
- Mike Polcari, SEMATECH
- Victoria Hadfield, SEMI
- Stanley T. Myers, SEMI
- Laurent Bosson, ST Microelectronics
- Yoshio Nishi, Stanford University
- John Lin, TSMC
- Mark Liu, TSMC
- Jenn Tsao, UMC
- Chia Pin Lee, United Microelectronics Corp.
- Dave Hodges, University of California at Berkeley
International Program Committee
- Chairman:
- Thomas Sonderman, AMD
- Committee:
- Bill Brennan, AMD/Spansion
- Bill Arnold, ASML
- Rajendra Singh, Clemson University
- Jeff McNeil, Cypress
- Lothar Pfitzner, Fraunhofer - IIS-B
- Linda Milor, Georgia Tech
- Marc Meuris, IMEC
- Joerg Domaschke, Infineon
- Gerald Elder, Intel
- Philip Moynagh, Intel
- Steve Swan, National Semiconductor
- Shi-Chung Chang, National Taiwan University
- Keith Hansen, Novellus
- Tae-Sung Kim, Samsung
- Chuck Stager,SEMATECH
- Scott S. Kramer, SEMATECH
- Fumitake Mieno, SMIC
- Christian Carlier, ST Microelectronics
- John Lin, TSMC
- Jenn Tsao, UMC
- Chia Pin Lee, United Microelectronics Corp.
- Costas Spanos, University of California at Berkeley
- Risto Puhakka, VLSI Research
- ASHRAF EL SAYED MOHAMED