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Biography

Joined Mitsubishi Electric Corporation in 1985.
Involved in the development and design of power semiconductor modules since 1990.
Since then, consistently in charge of work related to power semiconductors.
From 2011, overseas (Germany) for about three years.
After returning to Japan, focus to strategy, marketing, and new market development, while working to develop semiconductor talent both inside and outside the company.
From August 2023, adding Human Resources Development Executive Advisor at the Fukuoka Semiconductor Reskilling Center.

Presentation

1. Functions and uses of power semiconductors
2. Silicon semiconductors and SiC semiconductors
3. Latest trends in power semiconductor modules (chips, packages, applications)
4. The future and challenges of WBG semiconductors

Biography

1985 Started working for IBM Japan
1996-1998 Leader of IBM SiView Standard product development
1999-2003 Project Manager of 300mm SiView projects
2004-2007 Manager of SiView Business Development
2008-2018 Industry Consultant of Global Electronics CoC (Center of Competence), IBM Corporation
2018-2022 Partner, member of Industry Academy of IBM Corporation
2022 Retired from IBM
2023 Started working for Rapidus corporation

Presentation

Biography

Joined Mitsubishi Electric Corporation in 1989, focusing on semiconductor packaging technology.
Transferred to Renesas Technology Corporation in 2003, and then to Renesas Electronics Corporation in 2010, leading the development of advanced packaging technologies.
Appointed Director of Packaging Development in 2016.
Since 2025, serving as R&D Center Vice President at Amkor Technology Japan, focusing on next-generation packaging using Japan�fs excellent manufacturing technologies.

Presentation

1: Package Development in Kyushu
2: Types and Functions of Semiconductor Devices
3: Diversifying Power Device Development Trends
4: Diversifying Sensor Development Trends