The paper submission has been closed.

This call for papers is directed to the semiconductor and photovoltaic community, and other relevant industries, such as display, LED, lamps or glass. Other industries employing AEC/APC may also submit papers.

• Paper Submission Start: Monday, May 19th, 2025
• Paper Submission Due: Friday, July 11th, 2025  Extended to Tuesday, August 5, 2025
• Notification of Paper acceptance: Monday, September 1st, 2025  Extended to Wednesday, September 10, 2025

AEC/APC Symposium Asia 2025 Paper Template

• The paper has to be used AEC/APC Symposium Asia Paper template.
• The first page consists of the text (max of 1,000 words) and the second page consists of figures, supporting data, charts, photos and drawings.

• Process/Tool Level APC : PTL
  - FDC, SPC, Chamber matching, Process monitoring, Predictive control
• Sensing : SN
  - Sensor development or utilization
• Fab Level APC : FAB
  - Run to run, Wafer to wafer, Sampling strategy, Defect inspection
• Virtual metrology : VM
  - Soft sensor, Process models, Reduction of measurement process / non-production wafers
• Yield management : YM
  - Yield prediction, Yield improvement, Yield modeling and management
• Manufacturing effectiveness and productivity : MEP
  - Throughput improvement, Productivity improvement, Cost optimization, Maintenance strategy, Production Scheduling
• Data analysis : DA
  - Bigdata analysis, Novel methods of data analysis and visualiation, AI, Machine learning, Statistical approaches
• IT infrastructure : IT
  - Infrastructures, Data collection, Standards
  - Security
• GX(Green Transformation) : GX
  - Environmental monitoring, GX using APC
• Advanced Packaging and Chiplets Integration : ACH
  - 3D bonding, RDL process using APC
• APC Strategy / Future needs : APS
  - Roadmap, Requirements
  - Smart Manufacturing, Digital Twin
  - Metaverse, Robotics