PROGRAM SCHEDULE
ISSM2018 Program Schedule at-a-glance(as of Dec 3rd)
Monday, December 10
Mon, Dec 10 | Tue, Dec 11 | Interactive
Room 1 : KFC Hall
Plenary Session
| 8:15 | Registration |
| 8:45 | Opening |
| 9:00 |
Tutorial Speech Discussion on LSI Configurations and Performances from Process to Upper Levels Prof. Hitoshi Wakabayashi, Tokyo Institute of Technology |
| 9:40 |
Tutorial Speech AI; Impact to Semiconductor industry Kenji Tsuda, Semiconductor Portal |
| 10:20 | Break |
| 10:30 |
Special talk Session Intelligent Manufacturing in Semi-conductor fabs Robert Chien, tsmc |
| 11:10 | Lunch Break |
| 12:00 |
Keynote Speech Yet Another Leap Forward with Intelligent Semiconductor Manufacturing Dr. Atsuyoshi Koike, Western Digital Corporation / Western Digital Japan |
| 12:40 |
Keynote Speech Reshaping the Semiconductor Industry with IoT Yuzuru Utsumi, ARM |
| 13:20 | Break |
Room 1 : KFC Hall
Session : Artificial Intelligence (AI)-1 & Invited
| 13:30 |
INVITED FPGA Technology Trend using Patent Association Analysis Masakazu Takahashi, Masashi Shibata and Kazuya Okamoto, Yamaguchi University |
| 13:50 |
PC-O-35 : Machine Learning Approaches for Process Optimization Yusuke Suzuki, Tokyo Electron Technology Solutions |
| 14:10 |
PC-O-55 : Anomaly Detection for Semiconductor Tools Using Stacked Autoencoder Learning CHIEH-YU CHEN, National Taiwan University |
| 14:30 |
PC-O-65 : Virtual Metrology Model Robustness Against Chamber Condition Variation by Using Deep Learning Takuro Tsutsui, Tokyo Electron |
| 14:50 |
PO-O-20 : Materials Informatics for Process and Material Co-optimization Fumiaki Tanaka, Tokyo Electron |
| 15:10 |
PO-O-40 : Applying Machine Learning for COA data analytics of raw materials on Semiconductor Manufacturing Chien Hui Leu, Powerchip Semiconductor |
| 15:30 | Author's Interview & Break |
Room 1 : KFC Hall
Session : Artificial Intelligence (AI)-2 & Process Control and Monitoring (PC)-1
| 15:50 |
YE-O-54 : A CNN-based Transfer Learning Method for Defect Classification in Semiconductor Manufacturing Kazunori Imoto, Toshiba |
| 16:10 |
eMDC-O-01 : < eMDC2018 Best Paper > Recurrent Reinforcement Learning for Predictive Overall Equipment Effectiveness Prof. Shi-Chung Chang, National Taiwan University |
| 16:30 |
PC-O-36 : Auto Threshold Management after Equipment Maintenance Hidetoshi Shinozaki, Mie Fujitsu Semiconductor |
| 16:50 |
PC-O-43 : An Advanced Fault Detection Method for Post-CMP Brush Scrubbers Yohei Hamaguchi, Renesas Semiconductor Manufactureing |
| 17:10 | Author's Interview & Break |
Room 1 : KFC Hall
Session : Final Manufacturing (FM)
| 17:30 |
FM-O-19 : Development of Half-inch FOWLP Process Line utilizing Minimal Fab KENJI MIYAKE, PMT |
| 17:50 |
FM-O-34 : Design of underfill materials for the latest package OSAMU SUZUKI, NAMICS |
| 18:10 | Author's Interview & Break |
| 18:30 | Welcome Reception |
Room2: KFC Hall Annex
Session : Manufacturing Control and Execution (MC)
| 13:30 |
MC-O-9 : Equipment Productivity Variability: throughput impact analysis Marco Velasco PINNA, ST Microelectronics |
| 13:50 |
MC-O-18 : Logistics Management Innovation, RFID Application on Intelligent Management of Valuable Assets Yong Ching Lin, UMC |
| 14:10 |
MC-O-30 : Precise Positioning System and Potential Application in a SMART Fab Chih Ming CHAN, Global Foundries |
| 14:30 |
MC-O-32 : Unveil the black box for performance efficiency of OEE for semiconductor wafer fabrication Chih Min Yu, YouThought |
| 14:50 |
MC-O-52 : Real-time Allocation of Multi-Type Production Resource with Due Date grouping for MTO Manufacturing Motoharu TANAKA, University of Tsukuba |
| 15:10 |
MC-O-59 : Optimization of Multi-type Resource Allocation for MTO-MTS mixed production Hiroyuki MOTOMIYA, University of Tsukuba |
| 15:30 | Author's Interview & Break |
Room2: KFC Hall Annex
Session : Yield Enhancement Methodology (YE)
| 15:50 |
YE-O-60 : Using Full Trace Analytics to Simplify Root Cause Analysis Tom Ho, BISTel |
| 16:10 |
YE-O-68 : Real Time Measurement of Exact Size and Refractive Index of Particles in Liquid by Flow Particle Tracking Method Takuya Tabuchi, Rion |
| 16:30 |
YE-O-28 : Inline scratch defect detection at post CMP step in FinFET device processing Mohammed Imrul Hossain, Samsung Austin Semiconductor |
| 16:50 |
YE-O-46 : Realization of skeleton wafer testing for electrical failure analysis Hiroshi Yanagita, Renesas Electronics |
| 17:10 | Author's Interview & Break |
Room2: KFC Hall Annex
Session : eMDC2018 Best Paper & Environment, Safety and Health (ES)
| 17:30 |
eMDC-O-03 : < eMDC2018 Best Paper > Process Window Optimization by Die to Database e Beam Inspection Dr. Tuung Luoh, Macronix |
| 17:50 |
ES-O-64 : Approaches to Facility Equipment and Production Tools for Energy Saving Activities Shunsuke Kuroki, Renesas Electronics |
| 18:10 | Author's Interview & Break |
| 18:30 | Welcome Reception |
Tuesday, December 11
Mon, Dec 10 | Tue, Dec 11 | Interactive
Room1: KFC Hall
Plenary Session
| 8:30 | Registration |
| 8:55 | Program Outline |
| 9:00 |
Keynote Speech A new manufacturing model in China's IC industry Dr. Richard Chang, SiEn (QingDao) Integrated Circuits |
| 9:40 |
Kyenote Speech Technology Roadmaps for Devices and Systems for Cloud/IoT-edge platforms Dr. Yoshihiro Hayashi, SDRJ |
| 10:20 | Break |
| 10:30 | 3mins Summary Presentation by Interactive Poster Speakers |
| 11:20 | Lunch Break |
| 12:10 |
Keynote Speech Some Manufacturing and Business Consideration for Advanced NAND Production Dr. Simon Yang, Yangtze Memory Technologies |
| 12:50 |
Keynote Speech Achievement Strategy of High Quality and Productivity with Lowest Input in High Volume Manufacturing Dr. JI CHUL YANG, SK Hynix |
| 13:30 | Break |
Room 1 : KFC Hall
Session : High Reliability & Contamination Control and Ultraclean Technology (UC) & Process & Metrology Equipment (PE)
| 13:40 |
PC-O-57 : Outlier Screening for Advanced Automotive Applications Xiao-Yu Li, Xilinx |
UC-O-56 : Withdraw |
14:00 |
UC-O-8 : Advanced Wafer Container Contamination Control Methods and Strategies in Power Device Manufacturing Markus Pfeffer, Fraunhofer IISB |
14:20 |
UC-O-22 : Development of extreme microanalysis technology for metallic impurity on a silicon wafer surface Syuhei Yonezawa, Tokyo Electron |
14:40 |
PE-O-11 : Development of a Minimal multi-target helicon sputtering tool Kazunori Takahashi, Tohoku University |
15:00 |
PE-O-50 : Super-multipoint thickness measurement technology by optical macro inspection system Hamada Takayuki, Toshiba Memory |
15:20 | Author's Interview & Break |
Room 1 : KFC Hall
Session : Process and Material Optimization (PO)
| 16:00 |
PO-O-12 : Gas Phase Pore Stuffing for the protection of organo-silicate glass dielectric materials Makoto Fujikawa, Tokyo Electron Technology Solutions |
| 16:20 |
PO-O-16 : An Accurate Method for Determining Pattern Collapse Occurrence for Nano-Structures Mitsunori Nakamori, Tokyo Electron Kyushu |
| 16:40 |
PO-O-33 : The electrical effect on Schottky barrier diodes of emitted hydrogen from dielectric films Tatsuya Shiraishi, TOSHIBA ELECTRONIC DEVICES & STORAGE |
| 17:00 |
PO-O-39 : A Study on Mechanisms of SiO2-CMP Shota Suzuki, FUJIMI INCORPORATED |
| 17:20 | Author's Interview & Break |
| 17:40 | Poster Session & ISSM Awards |
Room2: KFC Hall Annex
Session : Process Control and Monitoring (PC) -2
| 13:40 |
PC-O-49 : Establishment of An Advanced Diagnostic Technology by Conductivity Akira Nakahira, Renesas Electronics |
| 14:00 |
PC-O-7 : Novel CMP technology for removal rate control of SiN Toshio Shinoda, FUJIMI INCORPORATED |
| 14:20 |
PC-O-15 : Improving thickness uniformity of sputter-deposited films by using magnet rotation speed control technique Tatsuhiko Miura, Toshiba Memory |
| 14:40 |
PC-O-25 : Predictive process control for change in chemical dry etching equipment condition Miyuki Maruta, TOSHIBA ELECTRONIC DEVICES & STORAGE |
| 15:00 |
PC-O-26 : Process Control Technique to Reduce Wafer Warpage for Trench Field Plate Power MOSFET Hiroaki Kato, TOSHIBA ELECTRONIC DEVICES & STORAGE |
| 15:20 |
PC-O-45 : Advanced Process Control Using Virtual Metrology to Cope with Etcher Condition Change Shota Umeda, Hitachi |
| 15:40 | Author's Interview & Break |
Room2: KFC Hall Annex
Session :丂Process Control and Monitoring (PC)-3 & Factory Design & Automated Material Handling (FD)
| 16:00 |
PC-O-63 : Real-time control of a wafer temperature for uniform plasma process Takayoshi Tsutsumi, Nagoya University |
| 16:20 |
PC-O-67 : Real-time Etch Control to Reduce First Wafer Effect in SF6/O2/Ar Plasma Sangwon Ryu, Seoul National University |
| 16:40 |
PC-O-66 : Prediction of the Number of Defects in Image Sensors by VM using Equipment QC Data Toshiya Okazaki, Sony Semiconductor |
| 17:00 |
FD-O-17 : Trailer based rail monitoring in overhead hoist transport systems Armin Siegel, TU Dresden |
| 17:20 | Author's Interview & Break |
| 17:40 | Poster Session & ISSM Awards |
3 minutes summary presentation by interactive poster speakers
Mon, Dec 10 | Tue, Dec 11 | Interactive
Room1: KFC Hall
| 10:30 | Introduction of 3mins summary presentation |
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MC-29 : Multi-Process , Products and Machine Control Chart Application in Semiconductors Cheng June Wu, Powerchip Semiconductor |
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MC-31 : Product mix optimization under required cycle time for semiconductor wafer fabrication Chih-Lin Chiu, YouThought |
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MC-53 : Control rule of metrology tool alignment for semiconductor cross FABs Tang-Chi Wang, Powerchip Semiconductor |
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PC-27 : Smart Sampling Methodology for Yield Defect Inspection in a 200mm Foundry Wafer Fab ANG KIAN HUAT, Global Foundries |
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PC-37 : Equipment Comparison Analysis using ANOVA of FDC Statistics Hidetoshi Shinozaki, Mie Fujitsu Semiconductor |
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PE-38 : Secondary electron spectroscopy for imaging semiconductor materials Toshihide Agemura, Hitachi High-Technologies |
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PO-13 : Inhibition of substrate heating in a Minimal Multi-Target Helicon sputtering tool Taichi Saito, Tohoku University |
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PO-23 : Resist coating and developing process technology toward EUV manufacturing sub-7nm node - Shinichiro Kawakami, Tokyo Electron |
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PO-51 : Optimization of polishing conditions of rectangular substrate Akira Ozeki, Nitta Haas |
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UC-47 : Characterization of Self-Contamination from PVA Roll Brush with Atomic Force Microscopy and Fluorescent Microscopy Shohei Shima, EBARA |
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YE-24 : Failure Mechanism of High Via Resistance Induced by Fluorine and Moisture Tong Tze Kang, X-FAB |